The course of Microelectronics I aims to transmit to the students the theoretical and practical foundations of the materials and processes used in the semiconductor industry and microelectronics, focusing on the manufacture of devices.
Pedro Miguel Cândido Barquinha
Weekly - 6
Total - Available soon
- R. Jaeger "Introduction to Microelectronic Fabrication", Addison Wesley Publishing Company (1993)
- S. Franssila "Introduction to Microfabrication", 2nd Edition, Wiley (2010)
- Lectures Slides.
The course content will be trasmitted according to a lecture method (with slideshow / powerpoint), encouraging interaction, dialogue-oriented and discussion with students in the classroom, stimulating pedagogical action. The lectures will be supplemented with the completion of 3 laboratory classes and solving multiple exercices, thus promoting a strong link between theory and practice.
Tests (relative weights). Optional and preferentially presential or if not possible via Moodle
- Theory: 50%
- Practical: 50%
The students who do not want to, or cannot, make tests may take an exam in "Exame season" that will replace the tests.
Marks >=15/20 obtained via Moodle can be subjected to subsequent oral examination
Conditions for exemption from exams:
- Average score of tests >=9.5.
Score >=9,5/20 in the group of:
- 3 group lab questionnaires about the lab works (60 %)
- Exercices to solve individually during the semester (20 %)
- Individual answers to scientific and technological questions related with the CU, released during the semester via Moodle (20 %)
It is valid for one year
50% tests average score* + 50% score TP (lab questionnaires, exercices, answers, see details in section above)
50% exam score* + 50% score TP ((lab questionnaires, exercices, answers, see details in section above)
(*) - If this score is less than 9.5 then the final score does not come into account with the TP score.
Theoretical / Practical
Chapter 1 - Perspective on the processes of microelectronics.
Chapter 2 - Growth of single crystals.
Chapter 3 - Thermal oxidation.
Chapter 4 - Etching
Chapter 5 - Lithography
Chapter 6 - Diffusion.
Chapter 7 - Ion Implantation.
Chapter 8 - Deposition of thin films.
Chapter 9 - Contacts and interconnections.
Chapter 10 - Future of microelectronics.
Processes in microelectronics
Lab work 1 - Thermal oxidation
Lab work 2 - Photolithography and Diffusion
Lab work 3 - Characterization of pn junction