Electronic Processes and Materials
Objectives
To give information related with fabrication of electronic components (resistors, capacitors, inductores, etc.) and also the materials used in the components and contact elements (circuit board; terminals, etc.) of an electronic circuit. Will discuss the processing techniques of printed circuits and hybrid circuits.
Besides that, it will also give theoretical and practical formation on soldering of electronic components (SMD and through hole).
General characterization
Code
11511
Credits
6.0
Responsible teacher
Hugo Manuel Brito Águas
Hours
Weekly - 4
Total - 74
Teaching language
Português
Prerequisites
|
There are no disciplines required prior to enrollment in this course. However it is assumed that student have general knowledge of mathematics and physics. |
Bibliography
Slides used in the course
SMT Soldering Handbook, Rudolf Strauss, 2nd edition, Elsevier
Electronic Materials And Processes Handbook, Malestrom, 3rd Edition, MacGrawHill
Lead-Free Soldering, Edited by Jasbir Bath, Springer
Teaching method
The course consists of practical classes (theoretical part and exercises) and laboratory practical classes, where students experience with the various electronic components studied, made their own setupsand components using the knowledge acquired in theoretical-practical lessons.
The course evaluation will consist of a set of tests or examination and reports made by the students (in groups) to report the laboratory work. The students'''''''''''''''''''''''''''''''' reports are discussed with the teacher.
The final score is calculated based on the weighted average of all test /exam with practical work.
Evaluation method
Students can be approved in the discipline, by tests or final exam. Minimum 5.5 values. (60%) The remaining 40% correspond to the evaluation of a pratical work (with 3 reports). Minimum of 9.5 values. The pratical work is done by groups of 45elements and will be evaluated individually.
APPROVAL:
The final rating will be
N = 0.6NTP +0.4NP
Subject matter
Lamination and encapsulation techniques. Circuits and assembling techniques. SMD. Failure analysis in processes.
Print circuits. Hybrid circuits. Integrated circuits. Materials for substrates. Processing and fabrication thecniques.
Capacitors: ceramic dielectrics, polymer dielectrics and paper dielectrics, aluminium and tantalum capacitors. Variable capacitors. Capacitor construction. Resistors: metal, screen-printing, variable resistors. Resistor construction. Insulation materials. Ceramics, polymers, oil and paper. Matirial and fabrication techniques for inductores.
Soldering: Solders and fluxes. Point soldering. Soldering of SMD components. Wave soldering. Reflow soldering. Lead-free solder.
Vaccum technology; Plasma technology for thin film deposition: (PECVD, PVD, Sputtering); Screen Printing; Inkjet Printing.