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  4. Microelectronics: Processes

Microelectronics: Processes

Objectives

The course of Microelectronics: Processes aims to transmit to the students the theoretical and practical foundations of the materials and processes used in the semiconductor industry and microelectronics, focusing on the manufacture of devices.

General characterization

Code

12696

Credits

6.0

Responsible teacher

Elvira Maria Correia Fortunato, Luís Miguel Nunes Pereira

Hours

Weekly - 5

Total - 80

Teaching language

Português

Prerequisites

Basic knowledge on Physics, Chemistry and Mathematics.

Bibliography

-       R. Jaeger "Introduction to Microelectronic Fabrication", Addison Wesley Publishing Company (1993)

-      Lectures Slides.

Teaching method

The course content will be trasmitted according to a lecture method (with slideshow / powerpoint), encouraging interaction, dialogue-oriented and discussion with students in the classroom, stimulating pedagogical action. The lectures will be supplemented with the completion of 5 laboratory clases, thus promoting a strong link between theory and practice.

Evaluation method

Evaluation:

Tests (relative weights)
- Theory: 50%
- Practical: 50%
 
Conditions for exemption from exams
- Average score of tests not less than 10 (9.5)​​.
 
"Frequencia"
Score equal to or higher than 10 in the final report of the lab classes
It is valid for one year
 
 
Final Score
 50% tests average score* + 50% report score
or
50% exam score* + 50%  report score

(*) - If this score is less than 9.5 then the final score does not come into account with the report of lab classes.

Students with a final average higher than 15 can be asked to orally defend the final classification.

Subject matter

Theoretical / Practical

Chapter 1 - Perspective on the processes of microelectronics.

Chapter 2 - Lithography.

Chapter 3 - Growth of single crystals.

Chapter 4 - Thermal oxidation.

Chapter 5 - Diffusion.

Chapter 6 - Ion Implantation.

Chapter 7 - Deposition of thin films.

Chapter 8 - Contacts and interconnections.

Chapter 9 - Encapsulation.

 

Lab classes

Manufacture of crystalline silicon diodes and MOS transistors 

Lab work 1 - Thermal oxidation and lithography

Lab work 2 - Diffusion

Lab work 3 - Thermal Oxidation II and lithography II

Lab work 4 - Deposition of metal contacts and lithography III

Lab work 5 - Characterization of electrical devices